Sputtering Target, Cu50Ni50 wt%, 2″ x .250″
Copper Nickel target, one side diameter 1.75″
Sputtering Target, Mg61.7Si35.6Bi2.7 wt%, 3″x0.2″ bonded to copper backing plate
Magnesium Silicon Bismuth target bonded to copper backing plate, cracks present(Box AA)
Sputtering Target, ZnTe 1:1.2 at% 1.5″x0.25″ bonded to Copper backing plate
Zinc Tellurium target bonded to 3.125″ Cu backing plate.
Sputtering Target, NaF 1.5″x0.125″ bonded to Copper backing plate
Sodium Flourine target, 3N purity bonded to 3.125″ Cu backing plate. Fragile material, some chips on edges. Reactive to oxygen, vacuum sealed packing
Sputtering Target, AlPO4 approx 3″ x 0.25″ bonded to 4″ copper backing plate
AlPO4 target bonded to Copper backing plate
Sputtering Target, Mn1Bi1 at % 4″x0.125″
Manganese Bismuth target, 3N5 purity
Sputtering Target, CdTe 3″ bonded to 4″ copper backing plate
Cadmium Tellluride 3″ target bonded to copper backing plate, 5N purity. packed in sealed wrapper
Sputtering Target, Ge2Sb2Te5 at% 3.004″ x 0.253″ w/ copper backing plate
Cracks along surface. 4N purity. Certificate of Analysis included.
Sputtering Target, ZnO target, 2″ x .250″ in copper cup
Zinc Oxide target in copper cup
Sputtering Target, KTaOx approx 3″x.25″w/ 4″ copper backing plate
Potassium Tantalum Oxide target bonded to copper backing plate
