Sputtering Target, Sn92.5Mg7.5 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Manganese target bonded to copper backing plate
Sputtering Target, Zinc 2″ x .250″
Zinc target
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate.
Sputtering Target, Sn86Bi14 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Bismuth target bonded to copper backing plate
Sputtering Target, Ni95Ti5 wt %, approximately 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate.
Sputtering Target, Si76.4Al6.6B17 wt %, 2.92″x .200″ w/ 4″ copper backing plate
Silicon Aluminum Boron target bonded to copper backing plate, 4N purity
CIGS Sputtering Target, Copper/Indium/Gallium 6-inch, copper backing plate
Indium 52.4. Gallium 11.8. 1/4″ thick, and professionally bonded to 1/4″ copper backing plate, having 20 countersunk holes.
Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate
Iron target 3N5 purity, bonded to copper backing plate
Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate
