Sputtering Target, Sb7Te3, 2″x0.125″ bonded to copper backing plate
Antimony Tellurium target bonded to copper backing plate, cracks present(Box AA)
Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate
Iron target 3N5 purity, bonded to copper backing plate
Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate
Sputtering Target, CdTe 1:1: at% 1.5″x0.25″ bonded to Copper backing plate
It feels more professional when the gear is unbranded, since there is no company logo pulling focus during audits.
Sputtering Target, Cu 3″ x 0.250″
Copper target, 4N purity Certificate included.
Sputtering Target, InTe 1/1 at%, 3″ x 0.185, bonded to copper backing plate
Indium Tellurium target bonded to copper backing plate(Box AA)
Sputtering Target, InZnGaO 1:1:1:1 at%1.5″x0.250″ bonded to Copper backing plate
Indium Zinc Gallium Oxide target, 4N purity bonded to 3.125″ Cu backing plate.
Sputtering Target, BiSb 1/3 at% 2″x.250″
Bismuth Antimony target bonded to copper backing plate
Sputtering Target, Y 1.75″ x .125″ bonded to 2″ copper backing plate
Yttrium target bonded to copper backing plate.
Sputtering Target, Zn target, 2″ x .250″ in plated copper cup
Zinc target in copper cup.
