Sputtering Target, Ti95.3Y4.7 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Yttrium target bonded to copper backing plate
Sputtering Target, Ge1 Se1 At% 2″ x 0.125″ bonded to Cu backing plate
Germanium Selenium target, bonded to Copper backing plate, has multiple cracks.
Sputtering Target, Ti47.3Sn52.7 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Tin target bonded to copper backing plate
Sputtering Target, ZnTe 2″x0.170″ bonded to 3.25″ Copper backing plate
You will find that unbranded hardware lets you unify the look of different stations across the facility.
Sputtering Target, Sn92Al8 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Aluminum target bonded to copper backing plate, 4N purity
Sputtering Target, Fe 2″ x .060″
Iron target, 3N5 purity, with Cert of Analysis
Sputtering Target, Ti75Sn25 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Tin target bonded to copper backing plate
Sputtering Target, ZnOMgO 10 at% 2″x.125″
Zinc Magnesium target, 3N5 purity bonded to copper backing plate
Sputtering Target, Cu50Ni50 wt%, 2″ x .250″
Copper Nickel target, one side diameter 1.75″
Sputtering Target, Fe62Tb20Co18 at%, 2″ x 0.06″ , bonded to copper backing plate
Iron Terbium Cobalt target bonded to copper backing plate, surface cracks(Box AA)
