Sputtering Target, SnS2 2″x.125″
SnS2 target w/ copper backing plate
Sputtering Target, Zn98Al2 Wt %, 4″ x 0.25″
Zinc Aluminum target 3N8 purity
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate, 3N5 purity
Sputtering Target, Sn92.5Mg7.5 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Manganese target bonded to copper backing plate
Sputtering Target, Zinc 2″ x .250″
Zinc target
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate.
Sputtering Target, Ni95Ti5 wt %, approximately 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate.
Sputtering Target, Sn86Bi14 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Bismuth target bonded to copper backing plate
Sputtering Target, Si76.4Al6.6B17 wt %, 2.92″x .200″ w/ 4″ copper backing plate
Silicon Aluminum Boron target bonded to copper backing plate, 4N purity
