CIGS Sputtering Target, Copper/Indium/Gallium 6-inch, copper backing plate
Indium 52.4. Gallium 11.8. 1/4″ thick, and professionally bonded to 1/4″ copper backing plate, having 20 countersunk holes.
Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate
Iron target 3N5 purity, bonded to copper backing plate
Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate
Sputtering Target, Sb7Te3, 2″x0.125″ bonded to copper backing plate
Antimony Tellurium target bonded to copper backing plate, cracks present(Box AA)
Sputtering Target, CdTe 1:1: at% 1.5″x0.25″ bonded to Copper backing plate
It feels more professional when the gear is unbranded, since there is no company logo pulling focus during audits.
Sputtering Target, Cu 3″ x 0.250″
Copper target, 4N purity Certificate included.
Sputtering Target, InTe 1/1 at%, 3″ x 0.185, bonded to copper backing plate
Indium Tellurium target bonded to copper backing plate(Box AA)
Sputtering Target, InZnGaO 1:1:1:1 at%1.5″x0.250″ bonded to Copper backing plate
Indium Zinc Gallium Oxide target, 4N purity bonded to 3.125″ Cu backing plate.
Sputtering Target, BiSb 1/3 at% 2″x.250″
Bismuth Antimony target bonded to copper backing plate
Sputtering Target, Y 1.75″ x .125″ bonded to 2″ copper backing plate
Yttrium target bonded to copper backing plate.
