Sputtering Target, Sn92.5Mg7.5 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Manganese target bonded to copper backing plate
Sputtering Target, Zinc 2″ x .250″
Zinc target
Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium Niobium target bonded to copper backing plate
Sputtering Target, Sn86Bi14 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Bismuth target bonded to copper backing plate
Sputtering Target, Si76.4Al6.6B17 wt %, 2.92″x .200″ w/ 4″ copper backing plate
Silicon Aluminum Boron target bonded to copper backing plate, 4N purity
Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate
Iron target 3N5 purity, bonded to copper backing plate
Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate
Nickel Titanium target bonded to copper backing plate
Sputtering Target, Sb7Te3, 2″x0.125″ bonded to copper backing plate
Antimony Tellurium target bonded to copper backing plate, cracks present(Box AA)
Sputtering Target, InTe 1/1 at%, 3″ x 0.185, bonded to copper backing plate
Indium Tellurium target bonded to copper backing plate(Box AA)
Sputtering Target, BiSb 1/3 at% 2″x.250″
Bismuth Antimony target bonded to copper backing plate
