Sputtering Target, Ti95.3Y4.7 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Yttrium target bonded to copper backing plate
Sputtering Target, Ti47.3Sn52.7 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Tin target bonded to copper backing plate
Sputtering Target, Sn92Al8 wt %, approx 3″x.25″w/ 4″ copper backing plate
Tin Aluminum target bonded to copper backing plate, 4N purity
Sputtering Target, Fe 2″ x .060″
Iron target, 3N5 purity, with Cert of Analysis
Sputtering Target, Ti75Sn25 wt %, approx 3″x.25″w/ 4″ copper backing plate
Titanium Tin target bonded to copper backing plate
Sputtering Target, ZnOMgO 10 at% 2″x.125″
Zinc Magnesium target, 3N5 purity bonded to copper backing plate
Sputtering Target, Cu50Ni50 wt%, 2″ x .250″
Copper Nickel target, one side diameter 1.75″
Sputtering Target, Fe62Tb20Co18 at%, 2″ x 0.06″ , bonded to copper backing plate
Iron Terbium Cobalt target bonded to copper backing plate, surface cracks(Box AA)
Sputtering Target, Mg61.7Si35.6Bi2.7 wt%, 3″x0.2″ bonded to copper backing plate
Magnesium Silicon Bismuth target bonded to copper backing plate, cracks present(Box AA)
Sputtering Target, ZnTe 1:1.2 at% 1.5″x0.25″ bonded to Copper backing plate
Zinc Tellurium target bonded to 3.125″ Cu backing plate.
